MG Chemicals Medium Cure Thermally Conductive Adhesive 6ml vendor_STI_ELECTRONICS Ten blades per card

Ten blades per card

Part Number: 872213

Low volumetric expansion and a negligible pressure drop at rated pressures

Now you can calibrate and test pressure devices quickly and easily with one hand

30 mA to 20 A AC rms Crest Factor 1

MG Chemicals Medium Cure Thermally Conductive Adhesive 6ml vendor_STI_ELECTRONICS Ten blades per cardOverview This heatsink adhesive paste is a 2 part, 1 1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies. This heatsink adhesive paste is a 2 part, 1 1 epoxy system. It